| Titre : |
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing |
| Type de document : |
texte imprimé |
| Auteurs : |
Sheng LIU, Auteur ; Yong LIU, Auteur |
| Editeur : |
John Wiley & Sons, Ltd |
| Année de publication : |
2011 |
| Importance : |
564 p. |
| ISBN/ISSN/EAN : |
978-0-470-82780-2 |
| Note générale : |
Contents
Foreword
Preface
Acknowledglments
About the Authors |
| Catégories : |
Matériaux:Fatigue:Mesure
Matériaux:Structure
Mécanique
Microélectronique
|
| Index. décimale : |
621.381 Electronique appliquée, micro-électronique |
| Résumé : |
MECHANICS AND MODELING
Constitutive Models and Finite Element Method
Material and Structural Testing for Small Samples
Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
Accelerated Fatigue Life Assessment Approaches for Solders in Packages
Multi-Physics and Multi-Scale Modeling
Modeling Validation Tools
Application of Fracture Mechanics
Concurrent Engineering for Microelectronics
MODELING IN MICROELECTRONIC PACKAGING AND ASSEMBLY
Typical IC Packaging and Assembly Processes
Opto Packaging and Assembly
MEMS and MEMS Package Assembly
System in Package (SIP) Assembly
MODELING IN MICROELECTRONIC PACKAGE RELIABILITY AND TEST
Wafer Probing Test
Power and Thermal Cyling, Solder Joint Fatigue Life
Passivation Crack Avoidance
Drop Test
Electromigration
Popcorning in Plastic Packages
MODERN MODELING AND SIMULATION METHODOLOGIES : APPLICATION TO NANO PACKAGING
Classical Molecular Dynamics
|
Faire une suggestion Affiner la rechercheLa microélectronique : De l'électron à la fabrication des puces.
